Built on Synopsys' Fusion Design Platform, world-class engines and data model, 3DIC Compiler offers a consolidated end-to-end solution with a full array of capabilities for advanced multi-die system ...

TSMC certifies CoWoS ® and InFO design flows based on the Synopsys 3DIC Compiler unified platform 3DIC Compiler accelerates advanced packaging design productivity Integrated with Ansys' chip-package ...

MOUNTAIN VIEW, Calif., Oct. 22, 2020 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5 ...

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

Alchip’s 3DIC test chip tape-validated the technology readiness of its 3DIC ecosystem that hits the sweet spot of design accuracy and time-to-market for AI and high-performance computing ASIC ...

WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die ...

3DIC design refers to semiconductor technology where multiple integrated circuits (ICs) are stacked vertically within a single package. This approach uses through-silicon vias (TSVs) and hybrid ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Lorentz Solution, Inc, a world leading provider of Electromagnetic (EM) design platform and simulation solutions, proudly joins the Intel Foundry Services (IFS) ...

Taipei, Taiwan, Sept. 04, 2025 (GLOBE NEWSWIRE) -- Alchip Technologies, the dedicated high-performance and AI computing ASIC leader, validated its 3DIC ecosystem readiness with results from its 3DIC ...

The MarketWatch News Department was not involved in the creation of this content. Production-Ready 3DIC Technology for Compact, Power-efficient Consumer Applications and High-performance AI and HPC ...