VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...

Toughened epoxy system EP21FL has a 4 to 1 mix ratio by weight and cures at ambient temperature. It has a low mixed viscosity of 2,000-4,500 cps. EP21FL has excellent electrical insulation properties ...

Epoxies are the most widely used polymeric materials for adhesives, sealants, coatings, pottings and encapsulations and impregnants. They are available in both one and two component systems. Two part ...

SAN DIEGO--(BUSINESS WIRE)--Kyocera announced today that its North American sales organization for epoxy molding compounds, die attach pastes, and all other semiconductor encapsulation products was ...

Sumitomo Bakelite plans to open a new manufacturing line to produce epoxy encapsulation composite materials for automotive applications at its Belgian production subsidiary Vyncolit NV. The investment ...

Master Bond Polymer System EP21TDC-2AN is a two component flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. This system’s exceptional thermal ...

Master Bond’s latest epoxy innovation, Super Gel 9, is a urethane modified epoxy gel featuring outstanding, unique properties. It is often used as a sealant and encapsulant for very challenging ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources. Sumitomo Bakelite, now ...