New Centris(TM) Sym3(TM) Etch system`s innovative chamber architecture enables precision removal of materials to the atomic level Already installed as a production tool of record with multiple ...

The Applied Materials Centris® Sym3® Y etch system enables chipmakers to precisely pattern and shape ever-smaller features in leading-edge memory and logic chips. The Applied Materials Centris® Sym3® ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--March 28, 2006--Applied Materials, Inc. today announced that Elpida Memory, Inc., a leading DRAM manufacturer, has selected the Applied Centura(R) AdvantEdge(TM) ...

New Tetra X system breaks the 2nm uniformity barrier to enable critical layer masks at 22nm Delivers industry’s best pattern-to-specification performance for optimized device yield Underlines ...

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1. University of Illinois researchers developed a method to chemically etch patterned arrays in the semiconductor gallium arsenide, used in solar cells, lasers, light emitting diodes (LEDs), field ...

A new cryogenic plasma etching technique developed by Japanese researchers dramatically accelerates semiconductor fabrication while cutting environmental impact, offering a potential breakthrough for ...

Dublin, Jan. 08, 2020 (GLOBE NEWSWIRE) -- The "Etch Process: Materials, Chemicals and Advances" report has been added to ResearchAndMarkets.com's offering. The report includes: Detailed study of the ...

Sym3® Y tailored to critical conductor etch applications in 3D NAND, DRAM and foundry-logic nodes Newest offering broadens adoption of the fastest-ramping product in company history Milestone reached: ...

New Centris Sym3 Etch system's innovative chamber architecture enables precision removal of materials to the atomic level Already installed as a production tool of record with multiple customers, the ...