Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

As integrated circuit (IC) designs have grown in complexity, scale and speed requirements, design rule checking (DRC) has evolved from a routine step into a critical pillar of successful tapeouts.

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...

Malaysia Semiconductor IC Design Park 2 represents a strategic shift towards higher-value activities such as IC design, advanced testing, validation, and research.