36th Annual State of Logistics Report: Navigating uncertainty amid rising costs and global disruptions The 36th Annual State of Logistics (SoL) Report highlights a logistics market tested by economic ...
The Indian Institute of Packaging (IIP) and the Plastics Packaging Research & Development Centre (PPRDC) have started a ...
Apple's persistent quest for better performance, longer battery life, and slimmer form factors appears to be driving its research into advanced chip packaging technologies. So-called "2.5D" and "3D" ...
Dr. Navid Asadi’s group examines chip packaging methods such as system-in-package (SIP). This is the second of a mutlipart series on chip packaging technologies. Peter (Chengjie) Xi is currently a ...
Dr. Navid Asadi’s group provides an introduction to conventional chip packaging methods in this first of a mutlipart series on chip packaging technologies. Navid Asadi is an assistant professor in the ...