The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
Live Science on MSN
MIT's chip stacking breakthrough could cut energy use in power-hungry AI processes
Engineers from MIT say that stacking circuit components on top of each other could be the answer to creating more ...
Data is an integral part of our lives. Contrary to the past, where files had to be removed periodically to free up storage space, we now assume that our data will never be deleted. Why risk deleting ...
SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...
Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, but how fast it can feed itself data. The long-feared “memory wall” is now ...
TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...
Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback