Packaging innovation has always been critical to the cooling of components, especially for power-switching devices such as MOSFETs and IGBTs. The non-stop demand to make these devices smaller and ...
After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT ...
NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...
RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.
RF Digital has released a fully FCC and CE-compliant 2.4GHz ULP wireless module in 15 by 15 by 3mm form factor powered by the nRF24LE1 ultra low power single chip transceiver, from wireless specialist ...
Module technology, including system-in-a-package (SiP) and multi-chip modules (MCMs), is creating attractive alternatives to the system-on-a-chip (SoC) design methodology for systems that require ...
The RF front-end market is undergoing a massive transformation, announces Yole Group in its new report, RF Front-End Module for Mobile 2025. The RF front-end module market for mobile devices is at a ...
The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...
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