Packaging innovation has always been critical to the cooling of components, especially for power-switching devices such as MOSFETs and IGBTs. The non-stop demand to make these devices smaller and ...
NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...
RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.
After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT ...
RF Digital has released a fully FCC and CE-compliant 2.4GHz ULP wireless module in 15 by 15 by 3mm form factor powered by the nRF24LE1 ultra low power single chip transceiver, from wireless specialist ...
The RF front-end market is undergoing a massive transformation, announces Yole Group in its new report, RF Front-End Module for Mobile 2025. The RF front-end module market for mobile devices is at a ...
Module technology, including system-in-a-package (SiP) and multi-chip modules (MCMs), is creating attractive alternatives to the system-on-a-chip (SoC) design methodology for systems that require ...
The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...
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