Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Intel Corp (NASDAQ:INTC) has tapped its long-term supplier, Taiwan Semiconductor Manufacturing Co (NYSE:TSM), for its advanced 2nm process. Intel and Taiwan Semiconductor are collaborating on a 2nm ...

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

Hsinchu, Sept. 20, 2023 /PRNewswire/ -- The introduction of Generative AI (GAI) has significantly increased the demand for advanced semiconductor chips, drawing increased attention to the development ...

SEALSQ Corp ("SEALSQ" or "Company") (NASDAQ: LAES), a leader in the fields of Semiconductors, PKI, and Post-Quantum technology, today announced a groundbreaking strategy set to incentivize the ...

The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of ...