NEC Electronics with Elpida Memory and Oki Electric, has developed technology to allow cell phones and portable devices to have as much memory as a high-performance computer. Single Package Can House ...

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

During the event, SK hynix showed off some of its AI memory products, including its new HBM3E 12-Hi stack memory which it started mass-producing in September, marking a significant milestone in the ...

Samsung has come out of the gate strong in 2024 by announcing it's developed a 12-layer version of the most cutting-edge high-bandwidth memory (HBM) available today, HBM3e. The development will move ...

As we have seen with various kinds of high bandwidth, stacked DRAM memory to compute engines in the past decade, just adding this wide, fast, and expensive memory to a compute engine can radically ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

Today Micron is announcing its newest version of high-bandwidth memory (HBM) for AI accelerators and high-performance computing (HPC). The company had previously offered HBM2 modules, but its newest ...