Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...
Carbice, a thermal interface material company, is showing off a cutting-edge thermal pad design at CES 2026, which it claims ...
Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel ...
The benefits of thermal interface materials. Comparing FR-4 laminate with insulated metal substrate (IMS) PCB. How phase-change TIMs may prove to be the best solution. One of the most important—and ...
Key performance characteristics and differences between gap-filler pads and new advances in thermal gels. Pads and gels both transfer heat effectively, but which one is better for your specific ...
Discover how heat resistant materials and material science innovations help electronics manufacturing manage rising temperatures, boost reliability, and enable smaller, more powerful next‑generation ...
Article updated on 17 August 2021. The mass adoption of electric transportation technologies requires electric energy storage and traction drive systems that offer improved performance, extended range ...
A new material has been developed by Texas researchers that can reportedly offer improved cooling capabilities to data centers. Researchers at the University of Texas at Austin have created a new ...
Dow and Carbice, a pioneer in carbon nanotube (CNT) technology, have announced a strategic, first-of-its-kind partnership to provide a multi-generational thermal interface material (TIM) product ...
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