Researchers at the Hokkaido University in Japan have used a novel approach of using cerium oxide (CeO2) as an active material in thermal switches to make them more efficient and sustainable to produce ...

The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...

New challenges facing thermal management include an increasing need for remote heat dissipation as well as more efficient thermal solutions with low weight, low cost, and high reliability. Heat pipes ...

The benefits of thermal interface materials. Comparing FR-4 laminate with insulated metal substrate (IMS) PCB. How phase-change TIMs may prove to be the best solution. One of the most important—and ...

Higher power density, smaller form factors and long-life reliability expectations all collide, requiring better thermal ...