Semiconductor Engineering

Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)

A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...

Webb finds early-universe analog's unexpected talent for making dust

Using NASA's James Webb Space Telescope, astronomers have spotted two rare kinds of dust in the dwarf galaxy Sextans A, one ...
Science Daily

Beyond silicon: These shape-shifting molecules could be the future of AI hardware

Scientists have developed molecular devices that can switch roles, behaving as memory, logic, or learning elements within the ...
Study Finds

Earth’s Core May Have An Onion-Like Structure Scientists Never Knew Existed

Earth's inner core may be layered like an onion, with silicon and carbon creating distinct zones that explain seismic wave ...
IEEE

Silicon Subwavelength Grating Coupler With Ultra-High Reproducibility, Ultra-Wide Bandwidth, and Ultra-Low Back Reflection

Abstract: Subwavelength grating (SWG) couplers have attracted great attention in silicon photonics due to the flexible capacity of index tailoring for light coupling. With the intrinsic high ...
Nature

A modular quantum processor made using phosphorus atoms in silicon

A high-performance silicon-based quantum processor has been developed in which the spins of nine phosphorus nuclei — divided into two groups, or registers — and two shared electrons act as quantum ...
IEEE

Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN)

Abstract: In this paper we discuss the driving forces for moving to chip backside power delivery. Possible integration flows and challenges are discussed for integrating through-silicon via (TSV) ...