A fully open-source platform provides a compact rheometer that can be easily combined with optical microscopy, allowing ...
Abstract: Gang bonding process (GBP) using thermal compression bonder (TCB) is being developed recently as a means to massively stack multi chips. However, the GBP using the TCB has a difficulty in ...
Abstract: Although cationic epoxy was optimized for low-melting SnBi58 solder ACF joints with the lowest coefficient of thermal expansion (CTE) in terms of reliability, cationic epoxy also showed a ...
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